Adjusting method of pattern transferring plate, laser application machine and pattern transferring plate

A laser application machine, comprising:

• a stage that holds a pattern transferring plate in which a pattern is formed on a substrate;
• a laser light source that generates laser light to be irradiated to the pattern transferring plate to form an altered portion within the substrate;
• a parameter adjustment unit that adjusts a parameter for laser irradiation in correspondence with thickness distribution of the substrate;
• and
• a laser control unit that controls laser irradiation within the substrate based on the parameter, wherein
• a height position of the altered portion is set such that a distance from a back surface of the substrate to the altered portion is constant and a height position of the altered portion is set such that a distance from the front surface of the substrate to the altered portion is different in correspondence with thickness distribution of the substrate to keep constant a transmission rate and a distortion amount of the altered portion by moving the stage up and down when laser light is emitted to the pattern transferring plate,
• or a height position of the altered portion is set such that a distance from the front surface of the substrate to the altered portion is constant and a height position of the altered portion is set such that a distance from the back surface of the substrate to the altered portion is different in correspondence with thickness distribution of the substrate to keep constant a transmission rate and a distortion amount of the altered portion by changing laser intensity or laser irradiation time.

A pattern transferring plate, comprising:

• a substrate;
• a pattern formed on a front surface of the substrate;
• and
• an altered portion in which height distribution within the substrate is set in correspondence with thickness distribution of the substrate, wherein
• a height position of the altered portion is set such that a distance from a back surface of the substrate to the altered portion is constant and a height position of the altered portion is set such that a distance from the front surface of the substrate to the altered portion is different in correspondence with thickness distribution of the substrate to keep constant a transmission rate and a distortion amount of the altered portion,
• or a height position of the altered portion is set such that a distance from the front surface of the substrate to the altered portion is constant and a height position of the altered portion is set such that a distance from the back surface of the substrate to the altered portion is different in correspondence with thickness distribution of the substrate to keep constant a transmission rate and a distortion amount of the altered portion.