Inductive inertial sensor architecture and fabrication in packaging build-up layers
AssigneeIntel Corporation
InventorsQing Ma, Feras Eid, Kevin Lin, Johanna M. Swan, Weng Hong Teh, Valluri R. Rao
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AssigneeIntel Corporation
InventorsQing Ma, Feras Eid, Kevin Lin, Johanna M. Swan, Weng Hong Teh, Valluri R. Rao
Estimating the term…
This invention relates to inductive inertial sensors employing a magnetic drive and/or sense architecture. In embodiments, translational gyroscopes utilize a conductive coil made to vibrate in a first dimension as a function of a time varying current driven through the coil in the presence of a magnetic field. Sense coils register an inductance that varies as a function of an angular velocity in a second dimension. In embodiments, the vibrating coil causes first and second mutual inductances in the sense coils to deviate from each other as a function of the angular velocity. In embodiments, self-inductances associated with a pair of meandering coils vary as a function of an angular velocity in a second dimension. In embodiments, package build-up layers are utilized to fabricate the inductive inertial sensors, enabling package-level integrated inertial sensing advantageous in small form factor computing platforms, such as mobile devices.
A gyroscope, comprising:
A method of determining an angular rate of rotation of a mobile device including a packaged integrated circuit (IC), the method comprising:
A gyroscope, comprising:
Dependencies are inferred from the claim text.