Variable frequency drive heat sink assembly
AssigneeCarrier Corporation
InventorsMichael F. Taras, KeonWoo Lee, Mark J. Perkovich, Suresh Duraisamy, XuQiang Liao, Claus E. Jorgensen, Arne F. Hansen
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AssigneeCarrier Corporation
InventorsMichael F. Taras, KeonWoo Lee, Mark J. Perkovich, Suresh Duraisamy, XuQiang Liao, Claus E. Jorgensen, Arne F. Hansen
Estimating the term…
A heat sink assembly is disclosed for cooling a power electronics module, such as a variable frequency drive. The heat sink assembly includes a housing and a heat sink structure. The housing defines an interior chamber for enclosing the power electronics module and also defines a cooling air flow channel exterior to the interior chamber. The heat sink structure is disposed in conductive heat transfer relationship with the interior chamber and has a heat transfer surface positioned within the exterior cooling air flow channel in convective heat transfer relationship with the cooling air flow.
A heat sink assembly for cooling a power electronics module comprising:
A variable frequency drive heat sink assembly comprising:
A method for cooling a power electronics module comprising:
Dependencies are inferred from the claim text.