A manufacturing method for base metal combination electrode of electronic ceramic component comprising an electronic ceramic chip and said base metal combination electrode, characterized by comprising:
- using thermal spray equipment to spray the base metal electrode material to the surface of electronic ceramic chip;
- wherein said using thermal spray equipment to spray the base metal electrode material to the surface of electronic ceramic chip comprises:
- a preparation step of loading material:
- loading the base metal electrode material into a spray gun of said thermal spray equipment connecting said spray gun with power or gas source, connecting it with compressed air at the same time, and adjusting the nozzle of the spray gun to face toward a fixing device for fixing a plurality of electronic ceramic chips;
- and
- a base metal electrode layer spraying step:
- opening the spray gun and spraying the base metal electrode material to the surface of the plurality of electronic ceramic chips in said fixing device;
- wherein said preparation step of loading material comprises:
- loading first base metal material into a first spray gun of said thermal spray equipment loading second base metal material into a second spray gun of said thermal spray equipment connecting said first spray gun and second spray gun with power supply or gas source, connecting them with compressed air at the same time, and respectively adjusting the nozzles of said first spray gun and second spray gun to face toward a first fixing device and a second fixing device for fixing a plurality of electronic ceramic chips;
- said base metal electrode layer spraying step comprises:
- a spraying step of the frontal side of first base metal electrode layer:
- opening a first spray gun and spraying first base metal electrode material to the frontal sides of the plurality of electronic ceramic chips in a first fixing device;
- a spraying step of the reverse side of the first base metal electrode layer:
- reversing said first fixing device, opening the first spray gun, and spraying the first base metal electrode material to the reverse sides of said plurality of electronic ceramic chips;
- a shifting step of the electronic ceramic chips:
- shifting and fixing the plurality of electronic ceramic chips sprayed with the first base metal electrode layer on both sides to a second fixing device;
- a spraying step of the reverse side of a second base metal electrode layer:
- opening a second spray gun and spraying second base metal electrode material to the first base metal electrode layer on the reverse sides of the plurality of electronic ceramic chips;
- a spraying step of the frontal side of the second base metal electrode layer:
- reversing said second fixing device, opening the second spray gun, and spraying the second base metal electrode material to the first base metal electrode layer on the frontal sides of said plurality of electronic ceramic chips;
- wherein the spraying precedence order of the frontal sides or the reverse sides of the electronic ceramic chips may change.