Heat dissipation system for communication device with box type chassis, box type chassis, and communication device

A communication device assembly, the communication device assembly comprising electronic components and a heat dissipation system;

• the heat dissipation system comprises a box type chassis and an air baffle;
• the air baffle, arranged in the box type chassis and configured to split an interior of the box type chassis into an upper heat dissipation channel and a lower heat dissipation channel;
• the upper heat dissipation channel and the lower heat dissipation channel both have an air exhaust vent and an air intake vent, the air intake vent and the air exhaust vent of the upper heat dissipation channel are defined on sidewalls of the box type chassis, the air intake vent and the air exhaust vent of the lower heat dissipation channel are defined on sidewalls of the box type chassis;
• and
• wherein the air intake vent of the upper heat dissipation channel is located above the air exhaust vent of the lower heat dissipation channel of the heat dissipation system;
• the air exhaust vent of the upper heat dissipation channel is located above the air intake vent of the lower heat dissipation channel;
• wherein the electronic components are located in the upper heat dissipation channel and the lower heat dissipation channel;
• and
• wherein a first channel is arranged at a position on the upper heat dissipation channel and near the air exhaust vent of the upper heat dissipation channel, and is used to guide air of the upper heat dissipation channel into the lower heat dissipation channel;
• wherein the first channel is implemented by arranging at least one through-hole on the air baffle.