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US 9,320,159 B2Granted
Cooling a secondary component by diverting airflow using an air channel associated with a thermal dissipation device that cools a primary component
AssigneeHewlett Packard Enterprise Development LP
InventorsKevin Leigh, Arlen L. Roesner
Life of this patent
Estimating the term…
Abstract
Heat is conducted from a primary component to a thermal dissipation structure. An airflow removes from the thermal dissipation structure. An air channel associated with the thermal dissipation structure diverts a portion of the airflow to a secondary component, thereby providing cooling to the secondary component.
Claims15
A heat sink for cooling a first component comprising:
- a thermal contact surface for conducting heat from the first component ;
- a thermal dissipation structure for conducting heat away from the thermal contact surface and dissipating heat into a directed airflow;
- and
- an air channel for diverting a portion of the directed airflow toward a second component to cool the second component , wherein the second component is not in direct thermal contact with the thermal contact surface or the thermal dissipation structure when the heat sink is deployed, and wherein an internal diameter of the air channel is comparatively narrower at an air exit point than an internal diameter of an air entry point of the heat sink to increase a velocity of the portion of the directed airflow at the air exit point relative to a velocity of the directed airflow at the air entry point.
1 more element
A system comprising:
- an enclosure, wherein a cooling airflow having a primary direction may be maintained within the enclosure during operation of the system;
- a mainboard in the enclosure;
- first and second components mounted to the mainboard;
- and
- a heat sink comprising:
- a surface in thermal contact with the first component;
- a thermal dissipation structure for conducting heat away from the surface and dissipating heat into the cooling airflow;
- and
- an airflow diversion member that urges a portion of the airflow toward the second component to cool the second component, and wherein an internal diameter of the airflow diversionary member is comparatively narrower at an air exit point than an internal diameter of an air entry point of the heat sink to increase a velocity of the portion of the directed airflow at the air exit point relative to a velocity of the directed airflow at the air entry point.
6 more elements
A method of cooling components comprising:
- conducting heat from a primary component to a thermal dissipation structure;
- providing an airflow having a primary direction to remove heat from the thermal dissipation structure;
- and
- diverting a portion of the airflow toward a secondary component using an air channel associated with the thermal dissipation structure to provide a velocity of the portion of the airflow at an air exit point of the air channel that is relatively greater than a velocity of the portion of the airflow at an air entry point of the air channel.
1 more element
Dependencies are inferred from the claim text.