Cooling assembly using heatspreader
AssigneeAlcatel Lucent
InventorsStefano F. De Cecco, Gregory W. Cheshire
Life of this patent
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Abstract
Various embodiments relate to a microchip die cooling assembly comprising a circuit board; a microchip having an exposed die attached to the circuit board; a heatspreader having a top side and a bottom side; a heat sink having a bottom side and a top side comprising a cooling structure; a first thermal interface material in contact with the exposed die and the bottom side of the heatspreader; and a second thermal interface material in contact with the top side of the heat spreader and the bottom side of the heat sink.
Claims10
A microchip die cooling assembly comprising:
- a circuit board;
- a microchip having an exposed die attached to the circuit board;
- a heatspreader having a top side and a bottom side, the bottom side being positioned above the microchip;
- a heat sink having a bottom side and a top side comprising a cooling structure;
- a first thermal interface material in contact with the exposed die and the bottom side of the heatspreader;
- a second thermal interface material in contact with the top side of the heatspreader and the bottomside of the heat sink;
- a pin connected to the heatspreader and circuit board securing the heatspreader to the circuit board;
- and
- a spring connected to the pin to bias the heatspreader against the microchip.
A heatspreader for use in an assembly for cooling a microchip with an exposed chip die, comprising:
- a body that formed from a thermally conductive material;
- a planar bottom surface having an area significantly greater than the area of the exposed chip die for thermally connecting to the exposed chip die;
- a planar top surface having an area equal to the area of the planar bottom surface;
- and
- two mounting features extending outward from each other in opposition in a plane parallel to the bottom surface for mounting the heatspreader in a resiliently biased thermal connection with the exposed chip die, wherein the resilient biased thermal connection includes a pin extending between the heatspreader and a circuit board to bias the heatspreader.
Dependencies are inferred from the claim text.