US 9,318,363 B2Granted

Substrate processing system and substrate position correction method

AssigneeTokyo Electron Limited

InventorsKozo Kai, Takamasa Chikuma, Keiji Osada, Chunmui Li

Life of this patent

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Abstract

In STEP 1, a mapping operation is carried out by a mapping device. In STEP 2, based on position information for the wafer (W) detected by the mapping operation, it is determined whether or not a wafer (W) position is in an abnormal state or not. When the wafer position is determined to be in the abnormal state (Yes), a closing/opening operation, in which a FOUP door (19c) is temporarily closed and then opened, is carried out in STEP 3. In STEP 4, the number of times the FOUP door (19c) is closed/opened (in other words, the number of times a port door (62) is closed/opened) is counted, and in STEP 5, it is determined whether or not this count value is less than a preset value. If the count value is less than the preset value (Yes), the processing in STEP 1-STEP 5 is repeated once again.

Claims6

Dependent claims

A substrate processing system that loads and unloads substrates through the use of a transport container accommodating and supporting the substrates in multiple stages, the transport container including an opening portion for inserting the substrates and an opening/closing door for opening or closing the opening portion, the system comprising:

a mounting unit on which the transport container is mounted;
an opening/closing device configured to hold the opening/closing door of the transport container mounted on the mounting unit to open or close the opening/closing door;
a mapping device configured to perform a mapping operation while the opening/closing door is kept open, the mapping operation including detecting and acquiring a position of each of the substrates accommodated within the transport container as substrate position information;
and
a first control unit configured to control the opening/closing device and the mapping device,
wherein the first control unit determines, based on the substrate position information detected by the mapping device, whether the substrate position is in a normal state or in an abnormal state,
wherein if the substrate position is in the abnormal state, the first control unit controls the opening/closing device to perform a closing/opening operation by which the opening/closing door is closed and then opened to correct the substrate position in the abnormal state, and thereafter, controls the mapping device to perform a next mapping operation,
wherein the first control unit controls the opening/closing device and the mapping device to repeat the closing/opening operation and the next mapping operation, and
wherein if the substrate position detected by the next mapping operation is in the normal state, the first control unit controls the opening/closing device and the mapping device to stop the closing/opening operation and the next mapping operation.

6 more elements

A substrate position correction method for correcting a position of each of substrates in a substrate processing system that loads and unloads the substrates through the use of a transport container accommodating and supporting the substrates in multiple stages, the transport container including an opening portion for inserting the substrates therethrough and an opening/closing door for opening or closing the opening portion, the system comprising:

a mounting unit on which the transport container is mounted;
an opening/closing device configured to hold the opening/closing door of the transport container mounted on the mounting unit to open or close the opening/closing door;
a mapping device configured to perform a mapping operation while the opening/closing door is kept open, the mapping operation including detecting and acquiring a position of each of the substrates accommodated within the transport container as substrate position information;
and
a control unit configured to control the opening/closing device and the mapping device, wherein the method comprises:
performing the mapping operation using the mapping device;
if it is detected in the mapping operation that the substrate position is in an abnormal state, performing a closing/opening operation by which the opening/closing door is closed and then opened to correct the substrate position in the abnormal state;
and
performing a next mapping operation using the mapping device,
wherein performing a closing/opening operation and performing a next mapping operation are repeated, and
wherein, if the substrate position detected by the next mapping operation is in a normal state, the repetition of performing a closing/opening operation and performing a next mapping operation is stopped.

8 more elements

A substrate processing system that loads and unloads substrates through the use of a transport container accommodating and supporting the substrates in multiple stages, the transport container including an opening portion for inserting the substrates therethrough and an opening/closing door for opening or closing the opening portion, the system comprising:

a mounting unit on which the transport container is mounted;
an opening/closing device configured to hold the opening/closing door of the transport container mounted on the mounting unit to open or close the opening/closing door;
a mapping device configured to perform a mapping operation while the opening/closing door is kept open, the mapping operation including detecting and acquiring a position of each of the substrates accommodated within the transport container as substrate position information;
and
a control unit configured to control the opening/closing device and the mapping device,
wherein the control unit includes:
a determination unit configured to determine, based on the substrate position information detected by the mapping device, whether the substrate position is in a normal state or in an abnormal state;
an opening/closing control unit configured to, if the determination result of the determination unit indicates the abnormal state, allow the opening/closing device to perform a closing/opening operation by which the opening/closing door is closed and then opened to correct the substrate position in the abnormal state;
and
a mapping operation control unit configured to allow the mapping device to perform a next mapping operation after the closing/opening operation is performed,
wherein the control unit controls the opening/closing device and the mapping device to repeat the closing/opening operation and the next mapping operation, and
wherein if the substrate position detected by the next mapping operation is in the normal state, the control unit controls the opening/closing device and the mapping device to stop the closing/opening operation and the next mapping operation.

9 more elements

Dependencies are inferred from the claim text.

Facts

Application: 14/370,973Filed 8 Jan 2013
Priority: JP 2012-00203810 Jan 2012
Published: US 2015/0005928 A11 Jan 2015
Granted: 19 Apr 2016
Term ends: Not estimatedThe source records don’t support an estimate.

Classification3 codes

H10P 72/0608
Position monitoring, e.g. misposition detection or presence detection: of substrates stored in a container, a magazine, a carrier, a boat or the like
H10P 72/3406
The wafers being stored in a carrier, involving loading and unloading: involving removal of lid, door or cover
H10P
Generic processes or apparatus for the manufacture or treatment of devices covered