Collet cleaning method and die bonder using the same

A collet cleaning method comprising:

• a wafer setting step of setting a wafer held by a dicing tape in a wafer ring;
• an initializing step of executing initialization of a die bonder, writing of map data for dies of the set wafer, and writing of an implementation program;
• a die starting position reading step of reading a starting position at which a collet starts to pick up the dies;
• a collet cleaning position determination step of reading a predetermined position on the dicing tape at which no dies exist using the die starting position as a reference point;
• a moving step of moving the collet to the predetermined position;
• a collet cleaning step of closely attaching the collet to the predetermined position on the dicing tape;
• and
• a die bonding step of executing die bonding by picking up the die from the die starting position, wherein
• the predetermined position is a position between the wafer and the wafer ring in plan view, and a margin of a position of the dicing tape where the wafer is held, and
• foreign substances attached to the tip end of the collet are removed at the predetermined position.