Pellicle, pressure-sensitive adhesive for pellicle, photomask with pellicle, and method for manufacturing semiconductor device

Abstract

To provide a pellicle having a an adhesive, wherein adhesive residue is decreased at the time of peeling the pellicle from a mask after lithographic exposure and outgassing from the adhesive is suppressed The pellicle according to the present invention is a pellicle comprising a pellicle frame, a tensioned pellicle film placed on one end surface of the pellicle frame and an adhesive applied to the other end surface thereof, in which the adhesive contains a (meth)acrylic alkyl ester copolymer and a silane compound, and the (meth)acrylic alkyl ester copolymer is a copolymer of a (meth)acrylic alkyl ester having an alkyl group of 4 to 14 carbon atoms and a monomer having a functional group reactive to at least either one of an isocyanate group or an epoxy group.

Dependencies are inferred from the claim text.