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US 9,309,588 B2Granted
Thin film deposition source, deposition apparatus and deposition method using the same
AssigneeSamsung Display Co., Ltd.
InventorJong Woo Lee
Life of this patent
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Abstract
A thin film deposition source, a deposition apparatus and a deposition method using the same are disclosed. The deposition apparatus includes a deposition source including a plurality of jet nozzles that spray a deposition substance on a surface of a substrate and are arranged in a first direction, and at least one shutter controlling a jet region of the deposition substance by opening or shielding at least a portion of a jetting passageway of the deposition substance.
Claims12
A thin film deposition method, comprising:
- forming a thin film on a substrate by jetting a deposition substance from a deposition source;
- measuring a thickness of the thin film while jetting the deposition substance and comparing the thickness of the thin film with a predetermined thickness;
- and
- after the measuring the thickness of the thin film and comparing the thickness of the thin film with the predetermined thickness, when the thickness of the thin film is greater than the predetermined thickness, further comprising, shielding at least a portion of a jet region of the deposition substance facing the thin film,
- wherein the jet region is between the substrate and the deposition source,
- after the measuring the thickness of the thin film and comparing the thickness of the thin film with the predetermined thickness, further comprising opening at least a portion of the jet region of the deposition substance facing the thin film when the predetermined thickness is greater than the thickness of the thin film,
- wherein the deposition source includes a plurality of jet nozzles that jet the deposition substance and are arranged in a first direction, and wherein the shielding or the opening at least a portion of the jet region is controlled by shielding or opening at least a portion of a jetting passageway of the deposition substance, and
- wherein each jet nozzle has a shutter including multiple shutter blades operating to symmetrically and axially lessen or widen an opening for the deposition substance to pass through.
5 more elements
A thin film deposition method, comprising:
- forming a thin film on a substrate by jetting a deposition substance from a deposition source;
- measuring a thickness of the thin film and comparing the thickness of the thin film with a predetermined thickness;
- and
- when the thickness of the thin film is greater than the predetermined thickness, shielding at least a portion of a jet region of the deposition substance facing the thin film,
- wherein the jet region is between the substrate and the deposition source, after the measuring the thickness of the thin film and comparing the thickness of the thin film with the predetermined thickness, further comprising opening at least a portion of the jet region of the deposition substance facing the thin film when the predetermined thickness is greater than the thickness of the thin film,
- wherein the deposition source includes a plurality of jet nozzles that jet the deposition substance and are arranged in a first direction,
- wherein the shielding or the opening at least a portion of the jet region is controlled by shielding or opening at least a portion of a jetting passageway of the deposition substance using at least one shutter,
- wherein the shutter comprises:
- at least one shutter plate holder formed to extend in the first direction and arranged in parallel with the plurality of jet nozzles;
- and
- at least one shutter plate protruding from the shutter plate holder in a direction toward the jet nozzles,
- and wherein a protruded distance of the shutter plate decreases in a direction toward a center of the shutter plate holder.
9 more elements
A thin film deposition method, comprising:
- forming a thin film on a substrate by jetting a deposition substance from a deposition source;
- measuring a thickness of the thin film and comparing the thickness of the thin film with a predetermined thickness;
- and
- when the thickness of the thin film is greater than the predetermined thickness, shielding at least a portion of a jet region of the deposition substance facing the thin film,
- wherein the jet region is between the substrate and the deposition source, after the measuring the thickness of the thin film and comparing the thickness of the thin film with the predetermined thickness, further comprising opening at least a portion of the jet region of the deposition substance facing the thin film when the predetermined thickness is greater than the thickness of the thin film,
- wherein the deposition source includes a plurality of jet nozzles that jet the deposition substance and are arranged in a first direction, wherein the shielding or the opening at least a portion of the jet region is controlled by shielding or opening at least a portion of a jetting passageway of the deposition substance using at least one shutter,
- and wherein the shutter is incorporated into each of the jet nozzles and controls jet amounts of the jet nozzles.
4 more elements
Dependencies are inferred from the claim text.