Substrate processing apparatus, substrate processing method and storage medium
AssigneeTokyo Electron Limited
InventorYoshifumi Amano
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AssigneeTokyo Electron Limited
InventorYoshifumi Amano
Estimating the term…
Provided is a substrate processing apparatus including a substrate holding unit configured to hold a wafer W horizontally, a rotation driving unit configured to rotate the substrate holding unit, a first chemical liquid nozzle configured to discharge a first chemical liquid to a first chemical liquid supplying position on the peripheral portion of the wafer W, and a second chemical liquid nozzle configured to discharge a second chemical liquid to a second chemical liquid supplying position on the peripheral portion of the wafer W. The rotation driving unit rotates the substrate holding unit in a first rotation direction when the first chemical liquid nozzle discharges the first chemical liquid, and rotates the substrate holding unit in a second rotation direction when the second chemical liquid nozzle discharges the second chemical liquid.
A substrate processing apparatus comprising:
A substrate processing method executed in a substrate processing apparatus including a substrate holding unit, a rotation driving unit, a first chemical liquid nozzle, a second chemical liquid nozzle, a first chemical liquid supplying and a second chemical liquid supplying unit, the substrate processing method comprising:
A storage medium that stores a computer program that, when executed, causes a computer to perform a substrate processing method executed in a substrate processing apparatus including a substrate holding unit, a rotation driving unit, a first chemical liquid nozzle, a second chemical liquid nozzle, a first chemical liquid supplying and a second chemical liquid supplying in using a substrate processing apparatus, the substrate processing method comprising:
Dependencies are inferred from the claim text.