Systems and methods for fabricating semiconductor device structures
AssigneeGlobalfoundries Inc.
InventorsAlok Vaid, Carsten Hartig, Lokesh Subramany
Life of this patent
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Abstract
Methods and systems are provided for fabricating and measuring physical features of a semiconductor device structure. An exemplary method of fabricating a semiconductor device structure involves obtaining raw measurement data for a wafer of semiconductor material from a metrology tool and adjusting a measurement model utilized by a metrology tool based at least in part on the raw measurement data and a value for a design parameter. The wafer has that value for the design parameter and an attribute of the semiconductor device structure fabricated thereon, wherein the measurement model is utilized by the metrology tool to convert the raw measurement data to a measurement value for the attribute.
Claims18
A method of fabricating a semiconductor device structure, the method comprising:
- obtaining raw measurement data for a wafer of semiconductor material from a metrology tool, the wafer having a first value for a design parameter and an attribute of the semiconductor device structure fabricated thereon, the metrology tool utilizing a measurement model to convert the raw measurement data to a measurement value for the attribute;
- and
- adjusting the measurement model based at least in part on the raw measurement data and the first value for the design parameter, wherein the method further comprises determining a second value for a quality metric associated with the measurement model based at least in part on the measurement value, and wherein adjusting the measurement model comprises adjusting the measurement model in response to determining the second value for the quality metric is less than a threshold value.
A method of fabricating a semiconductor device structure, the method comprising:
- fabricating a feature of the semiconductor device structure on a first wafer of semiconductor material having a first value for a design parameter;
- obtaining first raw measurement data for the first wafer from a metrology tool, the metrology tool utilizing an existing measurement model;
- determining an adjusted measurement model based at least in part on the first raw measurement data, the first value, second raw measurement data obtained from the metrology tool for a second wafer, and a second value, the second wafer having the second value for the design parameter;
- configuring the metrology tool to utilize the adjusted measurement model when a quality metric indicates the adjusted measurement model is better than the existing measurement model.
A computer-readable medium having computer-executable instructions stored thereon executable by a computing device to:
- obtain raw measurement data for a wafer of semiconductor material from a metrology tool, the wafer having a first value for a design parameter and an attribute of a semiconductor device structure fabricated thereon, the metrology tool utilizing a measurement model to convert the raw measurement data to a measurement value for the attribute;
- and
- adjust the measurement model based at least in part on the raw measurement data and the first value for the design parameter, wherein the computer-executable instructions stored thereon are executable by the computing device to determine a second value for a quality metric associated with the measurement model based at least in part on the measurement value, wherein the measurement model is adjusted in response to determining the second value for the quality metric is less than a threshold value.
Dependencies are inferred from the claim text.