Methods of patterning substrates
AssigneeMicron Technology, Inc.
InventorDan Millward
Life of this patent
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AssigneeMicron Technology, Inc.
InventorDan Millward
Estimating the term…
A method of patterning a substrate includes forming spaced first features over a substrate. Individual of the spaced first features include sidewall portions of different composition than material that is laterally between the sidewall portions. A mixture of immiscible materials is provided between the spaced first features. At least two of the immiscible materials are laterally separated along at least one elevation between adjacent spaced first features. The laterally separating forms a laterally intermediate region including one of the immiscible materials between two laterally outer regions including another of the immiscible materials along the one elevation. The laterally outer regions are removed and material of the spaced first features is removed between the sidewall portions to form spaced second features over the substrate. Other embodiments are disclosed.
A method of patterning a substrate, comprising:
A method of patterning a substrate, comprising:
A method of patterning a substrate, comprising:
A method of patterning a substrate, comprising:
A method of patterning a substrate, comprising:
A method of patterning a substrate, comprising:
A method of patterning a substrate, comprising:
A method of patterning a substrate, comprising:
Dependencies are inferred from the claim text.