Chemically amplified negative resist composition, photo-curable dry film, making method, pattern forming process, and electric/electronic part protecting film

A chemically amplified negative resist composition comprising

• (A) a resin having a crosslinking group or a reaction site susceptible to crosslinking reaction within the molecule,
• (B) a crosslinker,
• (C) a photoacid generator which is decomposed to generate an acid upon exposure to light of wavelength 190 to 500 nm,
• (D) a solvent, and
• (E) at least one amine compound having a fluoroalkyl Group and a morpholine structure
• wherein component (A) is a silicone structure-bearing polymer comprising recurring units of the general formula (1) and having a weight average molecular weight of 3,000 to 500,000,
• wherein R1 to R4 are each independently a monovalent C1-C8 hydrocarbon group, m is an integer of 1 to 100, a, b, c and d each are 0 or a positive number, with the proviso that a, b, c and d are not equal to 0 at the same time, and a+b+c+d=1,
• X is a divalent organic group of the general formula (2):
• wherein Z is a divalent organic group selected from the following:
• n is 0 or 1, R5 and R6 are each independently C1-C4 alkyl or alkoxy, and k is 0, 1, or 2, and
• Y is a divalent organic group of the general formula (3):
• wherein V is a divalent organic group selected from the following:
• p is 0 or 1, R7 and R8 are each independently C1-C4 alkyl or alkoxy, and h is 0, 1, or 2, and
• component (B) is at least one crosslinker selected from the group consisting of an amino condensate modified with formaldehyde or formaldehyde-alcohol, a phenol compound having on the average at least two methylol or alkoxymethylol groups in the molecule, and a polyhydric phenol compound having a hydroxyl group substituted by a glycidoxy group.