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US 9,113,634 B1Granted
Panel assembly with interstitial copper
AssigneeModular Services Company
InventorTaylor C. Culpepper
Life of this patent
Estimating the term…
Abstract
The present invention provides a panel assembly comprising a plurality of panels arranged in edge-to-edge format having joints between each pair of adjacent panels in the assembly. A copper-containing material, such as copper tape with adhesive backing, is provided in or near the joints in the assembly to render the joints less susceptible to bacterial contamination.
Claims8
A panel assembly having an outer surface, the panel assembly adapted for installation in a space so that the outer surface of the panel assembly is exposed to human contact, the panel assembly comprising:
- a plurality of panels, wherein each of the plurality of panels comprises a peripheral edge, and wherein the panels are arranged in edge-to-edge formation forming an interstitial space between at least two adjacent panels;
- and
- a deposit of antibacterial material positioned in or adjacent to the interstitial space, wherein the interstitial space with the antibacterial material positioned therein or adjacent thereto form an open crevice in the outer surface of the panel assembly, and wherein the antibacterial material comprises an amount of copper sufficient to render the crevice bactericidal.
Dependencies are inferred from the claim text.