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US 9,072,162 B2Granted
Conductive plastic overmold on shielded plastic window
AssigneeParker-Hannifin Corporation
InventorsMatthew Finley, John Perkins, Peter Z. Torok, Robert H. Foster, Robert Cowperthwait, John H. Beswick, David Inman
Life of this patent
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Abstract
An integrated assembly is provided for installation on a housing for electronic components. The integrated assembly includes a shielded window and a bezel overmolded onto the shielded window in an injection molding process. Since both the shielded window and the bezel have EMI resistant properties, the assembly represents an efficient method for providing high quality EMI shielding while eliminating the use of costly parts and assembly procedures.
Claims6
An integral EMI shielded window assembly comprising:
- an EMI-shielded window having an outer perimeter, said window comprising an electrically-conductive wire mesh laminated between adjacent glass or plastic sheets;
- an overmolded electrically-conductive plastic bezel providing an environmentally secure seal around the outer perimeter of the window and forming a single integral unitary structure with the window;
- and a busbar contacting the wire mesh and bezel providing electrical conductivity between the wire mesh and bezel, said busbar being coated with an electrically conductive coating.
Dependencies are inferred from the claim text.