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US 9,070,642 B2Granted
Electronic module
AssigneeInfineon Technologies AG
InventorsMartin Standing, Johannes Schoiswohl
Life of this patent
Estimating the term…
Abstract
An electronic module includes a first semiconductor chip and a passive component, wherein the first semiconductor chip is arranged on a surface of the passive component.
Claims24
An electronic module comprising:
- a passive component having an upper surface of a first area;
- and
- a first semiconductor chip having a lower surface of a second area that is smaller than the first area, wherein the lower surface of the first semiconductor chip is arranged on the upper surface of the passive component, wherein the first semiconductor chip is electrically and mechanically attached to the passive component, and wherein the first semiconductor chip comprises a vertical field-effect transistor.
An electronic module comprising:
- a passive component having an upper surface of a first area;
- a first semiconductor chip having a lower surface of a second area that is smaller than the first area, wherein the lower surface of the first semiconductor chip is arranged on the upper surface of the passive component, and wherein the first semiconductor chip is electrically and mechanically attached to the passive component;
- and
- at least one capacitor electrically coupled to the first semiconductor chip or the passive component, wherein the at least one capacitor comprises an input capacitor and an output capacitor.
1 more element
An electronic module comprising:
- a passive component having an upper surface of a first area;
- and
- a semiconductor chip having a lower surface of a second area that is smaller than the first area, wherein the lower surface of the semiconductor chip is arranged on the upper surface of the passive component, wherein the semiconductor chip is electrically and mechanically attached to the passive component,
- wherein the passive component comprises a recess in the surface, spatial dimensions of the recess corresponding to spatial dimensions of the semiconductor chip or to spatial dimensions of a substrate carrying the semiconductor chip, and
- wherein the passive component comprises at least one electrical terminal situated below the recess.
2 more elements
Dependencies are inferred from the claim text.