Device mounter head and device mounting method using the same
AssigneeSamsung Techwin Co., Ltd.
InventorJong-eok Ban
Life of this patent
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AssigneeSamsung Techwin Co., Ltd.
InventorJong-eok Ban
Estimating the term…
A device mounter head and a device mounting method using the device mounter head are provided. The device mounter head includes: a cylinder block unit including at least one cylinder in which a piston unit moving along the at least one cylinder is disposed; a pressure control unit which controls pressure inside and outside the at least one cylinder so that the piston moves along the at least one cylinder based on the controlled pressure; and a nozzle which is connected to the piston unit, and includes an inlet exposed to an atmosphere outside the cylinder block unit and a nozzle communication vent connected to the inlet and provided with the controlled pressure, wherein the inlet is configured to suck, grab and release a component using the controlled pressure.
A device mounter head comprising:
A device mounter head comprising:
Dependencies are inferred from the claim text.