Integrated device and manufacturing method

An integrated device in which an optical element and an electrical element are implemented on a substrate and a plurality of laser diodes, a plurality of wavelength multiplexers, and a plurality of 90° pitch converters are arranged on the substrate, wherein

• materials of the optical element and the electrical element have different coefficients of thermal expansion from each other,
• the optical element and the electrical element are bonded by surface-activated bonding technology to a bonding portion that is formed on the substrate and made of metal material, a bonding state of the bonding portion bonded by the surface-activated bonding technology is reinforced by resin,
• a waveguide is formed on the substrate and connected to the optical element directly,
• an interval between the plurality of wavelength multiplexers is small compared to an interval among the plurality of laser diodes, and
• the plurality of 90° pitch converters are provided at corners, formed by inputs to the plurality of wavelength multiplexers and waveguides for connecting the plurality of laser diodes, to align a pitch of the waveguides on a side of the plurality of laser diodes with that on a side of plurality of wavelength multiplexers.