Masking layer formed by applying developable photosensitive resin compositions on panel structure

A masking layer produced by coating a white-color photosensitive resin composition on a peripheral region of a surface of a transparent substrate of a panel structure, developing the white-color photosensitive resin composition to obtain a cured and patterned composition layer, and then coating a gray-color photosensitive resin composition on the patterned composition layer and developing the gray-color photosensitive resin composition, so that the gray-color photosensitive resin composition is cured and patterned to obtain the masking layer having an optical density (O.D.) of ≧3.5, wherein:

• the white-color photosensitive resin composition comprises 5˜15 wt % of a resin ingredient, from more than 0 wt % to 2 wt % of a photo-initiator, 5˜15 wt % of a monomer ingredient, 40˜70 wt % of a solvent and 10˜30 wt % of a white pigment;
• and
• the gray-color photosensitive resin composition comprises 5˜15 wt % of a resin ingredient, from more than 0 wt % to 2 wt % of a photo-initiator, 5˜15 wt % of a monomer ingredient, 40˜70 wt % of a solvent, 10˜30 wt % of a white pigment and from more than 0 wt % to 3 wt % of a black pigment.