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US 9,049,778 B2Granted
Polyamic acid, photosensitive resin composition, dry film and circuit board
AssigneeLG Chem, Ltd.
InventorsYou-Jin Kyung, Hee-Jung Kim, Kwang-Joo Lee, Jung-Hak Kim
Life of this patent
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Abstract
The present invention relates to novel polyamic acid; a photosensitive resin composition satisfying excellent flexibility and low stiffness and exhibiting excellent heat resistance and plating resistance; a dry film obtained from the photosensitive resin composition; and a circuit board including the dry film.
Claims18
Polyamic acid comprising a repeat unit of the following Chemical Formula 1:
- in the Chemical Formula 1,
- X1 and X2 are identical or different, and independently a tetravalent organic group,
- R1, R2, R3 and R4 are identical or different, and independently a C1-10 linear or branched alkylene group,
- R5 is a C1-10 linear or branched alkyl group,
- x, y and z are independently an integer greater than or equal to 1, and
- n is an integer greater than or equal to 0.
3 more elements
Dependencies are inferred from the claim text.