Light emitting device package

A light emitting device package comprising:

• first and second light emitting devices;
• a body having a first cavity in which the first light emitting device is provided and a second cavity in which the second light emitting device is provided;
• a resin material formed in the cavity;
• a first heat conductive member only under the first light emitting device and on a lower surface of the first cavity, and the first heat conductive member provided in the first cavity;
• and
• a second heat conductive member only under the second light emitting device and on a lower surface of the second cavity, and the second heat conductive member provided in the second cavity, wherein the resin material includes:
• a first resin material formed in the first cavity,
• a second resin material formed in the second cavity, and
• a third resin material formed an upper surface of the first and second resin materials,
• wherein at least one of the first resin material and the second resin material includes a light diffusing material that includes a white metal oxide,
• wherein a thermal conductivity of the first heat conductive member provided between the first light emitting device and the lower surface of the first cavity is different from a thermal conductivity of the second heat conductive member provided between the second light emitting device and the lower surface of the second cavity,
• wherein the first light emitting device to emit more heat than the second light emitting device,
• wherein the first heat conductive member has a higher conductivity than the second heat conductive member, and
• wherein a width of the first heat conductive member on the lower surface of the first cavity is greater than a width of the second heat conductive member on the lower surface of the second cavity, and the width of the first heat conductive member is greater than a width of the first light emitting device.