Light emitting device, method for fabricating the light emitting device, and light emitting device package

A light emitting device package, comprising:

• a light emitting device;
• a body on which the light emitting device is mounted;
• first and second electrodes disposed on the body, the first and second electrodes being electrically connected to the light emitting device;
• and
• a molding member surrounding the light emitting device,
• wherein the light emitting device comprises:
• a conductive support member electrically connected to the first electrode;
• a light emitting structure on the conductive support member, the light emitting structure comprising a first conductive type semiconductor layer, an active layer under the first conductive type semiconductor layer, and a second conductive type semiconductor layer under the active layer;
• an electrode member on the first conductive type semiconductor layer of the light emitting structure;
• and
• a protection member covering a portion of the light emitting structure,
• wherein the light emitting structure has a first top surface and a second top surface under the first top surface, the first and second top surfaces of the light emitting structure have a stepped structure, and the protection member having a top surface is disposed on the second top surface of the light emitting structure, and
• wherein a bottom surface of the protection member is spaced apart from both a side surface and a top surface of the active layer, and
• wherein a top surface of the first conductive type semiconductor layer is exposed through the protection member, and wherein a top-most surface of the first conductive semiconductor layer is substantially flush with a top-most surface of the protection member.