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US 9,041,019 B2Granted
Method of and device for manufacturing LED assembly using liquid molding technologies
AssigneeFlextronics AP, LLC
InventorsSamuel Tam, Murad Kurwa, Dick Pang
Life of this patent
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Abstract
A method of and a system for making LED comprising concurrently forming multiple dam structures on a whole silicon wafer using a liquid transfer mold, attaching dies to the silicon wafer inside each of the dam structure, performing flux reflow, cleaning flux, performing wire bonding, dispensing phosphor, curing the phosphor, concurrently forming dome structures by using a liquid transfer mold on all of the dam structures, mounting wafer, and using a saw for single or multiple LED(s) singulation.
Claims15
A method of making a LED assembly comprising:
- a. forming multiple dam structures on a whole silicon wafer using a liquid transfer mold, wherein the liquid transfer mold comprises a top mold and a bottom mold configured to press against each other and using an inner structure of the mold complimentary to the dam structures to concurrently form the multiple dam structures;
- b. coupling multiple LED dies on the silicon wafer within each of the dam structures;
- c. adding phosphor to an area enclosed by the multiple dam structures;
- d. curing the phosphor;
- and
- e. encapsulating the phosphor.
3 more elements
A method of making LED comprising:
- a. concurrently forming an array of plural dam structures on a silicon wafer using a liquid transfer mold, wherein the liquid transfer mold comprises a top mold and a bottom mold configured to press against each other and using an inner structure of the liquid transfer mold complimentary to the dam structures to concurrently form the multiple dam structures;
- b. coupling one or more of LED dies to the plurality of the dam structures;
- c. coupling wires to the LED dies;
- d. adding phosphor to be contained within the dam structure;
- and
- e. forming a dome structure on each of the dam structure using a liquid transfer mold.
3 more elements
A method of making LED comprising:
- a. concurrently forming multiple dam structures on a whole silicon wafer using a first liquid molding, wherein the first liquid molding comprises a top mold and a bottom mold configured to press against each other and using an inner structure of the first liquid molding complimentary to the dam structures to concurrently form the multiple dam structures;
- b. attaching at least one die to each of the multiple dam structure;
- c. performing flux reflow;
- d. performing flux cleaning;
- e. performing wire bonding;
- f. dispensing phosphor after wire bonding;
- g. curing the dispensed phosphor;
- h. concurrently forming a dome structure on each of the multiple dam structures using a second liquid molding;
- i. mounting the whole silicon wafer;
- and
- j. sigulating by a saw.
8 more elements
Dependencies are inferred from the claim text.