LED module

An LED module comprising:

• a substrate including rectangular main and rear surfaces which are opposite each other, each of the main and rear surfaces having a longer side and a shorter side;
• a side surface being a mounting surface and connecting the longer sides of the main and rear surfaces and being perpendicular to said main surface and said rear surface;
• one or more LED chips supported by the main surface of the substrate;
• a light transmitting resin formed on the main surface of the substrate, the light transmitting resin having a surface flush with the side surface of the substrate;
• and
• wirings which are formed on the substrate and make electrical conduction with the LED chips,
• wherein the substrate includes one or more through holes penetrating from the main surface to the rear surface,
• wherein the wirings include pads which are formed on the main surface and make electrical conduction with the LED chips, rear surface electrodes which are formed on the rear surface, and through wirings which make electrical conduction between the pads and the rear surface electrodes and are formed on the inner sides of the through holes,
• wherein three spaced LED chips are arranged along a longitudinal direction of the main surface,
• wherein the substrate includes two through holes and the wirings include two through wirings,
• wherein the substrate has a pair of lateral sides connecting the main surface and the rear surface in both ends of the substrate in the longitudinal direction and two corner grooves which are interposed between the lateral sides and the side surface, and reach the main surface and the rear surface in a thickness direction of the substrate, and
• wherein the wirings include two corner groove wirings formed on the inner sides of the two corner grooves.