Package structure and methods of forming same
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsJui Hsieh Lai, Ying-Hao Kuo, Hai-Ching Chen, Tien-I Bao
Life of this patent
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Abstract
A semiconductor device, a package structure, and methods of forming the same are disclosed. An embodiment is a semiconductor device comprising a first optical device over a first substrate, a vertical waveguide on a top surface of the first optical device, and a second substrate over the vertical waveguide. The semiconductor device further comprises a lens capping layer on a top surface of the second substrate, wherein the lens capping layer is aligned with the vertical waveguide, and a second optical device over the lens capping layer.
Claims21
A semiconductor device comprising:
- a first optical device over a first substrate;
- a vertical waveguide on a top surface of the first optical device;
- a second substrate over the vertical waveguide, the second substrate comprising a first portion having a planar top surface coplanar with a top surface of the second substrate and a planar bottom surface coplanar with a bottom surface of the second substrate;
- a lens capping layer on the top surface of the second substrate, wherein the lens capping layer is aligned with the vertical waveguide, the first portion of the second substrate being directly between the vertical waveguide and the lens capping layer;
- and
- a second optical device over the lens capping layer.
A package structure comprising:
- a first redistribution layer over a first side of a first substrate;
- a first optical device bonded to the first redistribution layer;
- a vertical waveguide directly on a top surface of the optical device;
- a second redistribution layer over the first side of the first substrate;
- a wire bond coupling the second redistribution layer to the top surface of the first optical device;
- a second substrate over the first substrate, a second side of the second substrate facing the first substrate, the second substrate comprising an optical transfer path contacting a top surface of the vertical waveguide, the optical transfer path being surrounded by the second substrate, the optical transfer path having a same material composition as surrounding portions of the second substrate;
- a first conductive joint bonding the first substrate to the second substrate;
- and
- a lens cap on a first side of the second substrate, the first side being opposite the second side, the lens cap being aligned with the vertical waveguide.
A device comprising:
- a first optical device over a first substrate;
- a polymer waveguide on a first surface of the first optical device;
- a second substrate having a first surface over the polymer waveguide and an optical transfer path, the first surface of the optical transfer path of the second substrate being nearest the polymer waveguide, the optical transfer path being a continuous material with the second substrate;
- a lens layer on a second surface of the second substrate, the second surface of the second substrate being opposite the first surface, wherein the lens layer is aligned with the polymer waveguide, the optical transfer path of the second substrate being directly between the polymer waveguide and the lens layer;
- and
- a second optical device over the lens layer.
Dependencies are inferred from the claim text.