Method for producing an optoelectronic component and component produced in such manner

A method of producing an optoelectronic component comprising:

• providing a semiconductor chip having an active layer that generates radiation and is arranged on a carrier,
• applying a dispersed material comprising a matrix material and particles embedded therein to the carrier at least in regions, wherein
• before the dispersed material is applied, at least one chip edge of the semiconductor chip facing away from the carrier is coated with a protective layer at least in places for modification such that the dispersed material at least partly separates into its constituents during application at the chip edge, and
• the protective layer changes the surface energy of the semiconductor chips such that the dispersed material does not adhere to a chip surface facing away from the carrier.