Light emitting device and lighing system having the same

A light emitting device comprising:

• a first and a second metal layers spaced from each other by a separation part;
• a light emitting chip disposed on a top surface of the first metal layer;
• an insulation layer disposed on top surfaces of the first and second metal layers and disposed around the light emitting chip;
• a reflection member disposed on a top surface of the insulation layer;
• a first wire connected to the light emitting chip and the second metal layer;
• a transparent resin layer contacted physically with the top surfaces of the first and second metal layers and the top surface of the insulation layer;
• and
• an adhesion layer disposed between the insulation layer and the first and second metal layers,
• wherein the insulation layer includes a first open area on the top surface of the first metal layer and a second open area on the top surface of the second metal layer,
• wherein the light emitting chip is disposed in the first open area,
• wherein the first wire connected to the second metal layer is disposed in the second open area,
• wherein a first portion of the insulation layer is corresponded between the first and second metal layers and has a width wider than an interval between the first and second metal layers on the top surfaces of the first and second metal layers,
• wherein a top surface of the reflection member is located higher than that of the light emitting chip,
• wherein the reflection member is disposed around the transparent resin layer,
• wherein an entire region of the reflection member is located higher than those of the first and second metal layers,
• wherein an outer portion of the insulation layer is not overlapped with the reflection member in a vertical direction and is extended outwardly from an outer sidewall of the reflection member,
• wherein the adhesion layer includes a first region disposed between the first portion of the insulation layer and the first metal layer and a second region disposed between the first portion of the insulation layer and the second metal layer,
• wherein the insulation layer has a thickness thicker than that of each of the first and second metal layers,
• wherein the adhesion layer includes an opening region on the separation part between the first metal layer and the second metal layer, and
• wherein the opening region of the adhesion layer is disposed between the first portion of the insulation layer and the separation part.

A light emitting device comprising:

• a first metal layer and a second metal layer spaced from each other;
• a first insulation film having an opened area in which an inner portion of top surfaces of the first and second metal layers is opened, the first insulation film being disposed around the top surfaces of the first and second metal layers;
• a light emitting chip disposed on a top surface of the first metal layer, the light emitting chip being electrically connected to the first and second metal layers;
• a second insulation film corresponding between the first and second metal layers;
• a resin layer disposed on the first and second of metal layers and the light emitting chip;
• a first guide member disposed on a top surface of the first insulation film and formed of a non-metallic material;
• and
• a second guide member disposed on a top surface of the second insulation film and formed of a non-metallic material,
• wherein the resin layer is disposed on the first and second guide members,
• wherein a first portion of the first guide member contacts the first and second metal layers, and
• wherein a first portion of the second guide member contacts the first metal layer and is disposed closer to the light emitting chip than the second insulation film.