Semiconductor device and method of manufacturing the same
AssigneeKabushiki Kaisha Toshiba
InventorsYukio Nakabayashi, Takashi Shinohe, Atsuko Yamashita
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AssigneeKabushiki Kaisha Toshiba
InventorsYukio Nakabayashi, Takashi Shinohe, Atsuko Yamashita
Estimating the term…
A semiconductor device of an embodiment includes a first conductive type silicon carbide substrate having first and second main surfaces, a first conductive type silicon carbide layer formed on the first main surface, a second conductive type first silicon carbide region formed in the silicon carbide layer, and a first conductive type second silicon carbide region formed in the first silicon carbide region. The device includes a trench penetrating through the first and second silicon carbide regions, and a second conductive type third silicon carbide region formed on a bottom and a side surface of the trench. The third silicon carbide region is in contact with the first silicon carbide region, and is formed between the trench and the silicon carbide layer. In addition, the device includes a gate insulating film formed in the trench, a gate electrode, a first electrode, and a second electrode.
A semiconductor device comprising:
A semiconductor device comprising:
Dependencies are inferred from the claim text.