Optoelectronic-device wafer probe and method therefor
OwnerJames Albert Walkerinventor
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Abstract
A probe card for wafer-level testing a plurality of optoelectronic devices on a wafer is provided. The probe card has both electrical and optical functionality. The probe card comprises a plurality of lenslets aligned with the plurality of optoelectronic devices to improve the optical coupling efficiency between each of the plurality of optoelectronic devices and a plurality of optical waveguides located on a probe head.
Claims19
An apparatus for wafer-level testing a plurality of optoelectronic devices arranged in a first arrangement on a device wafer, the apparatus comprising:
- a probe card having electrical functionality and optical functionality, wherein the probe card comprises;
- (i) a first substrate comprising a plurality of electrical pins, the electrical pins being arranged to electrically activate each of the plurality of optoelectronic devices;
- and
- (ii) a plurality of first optical elements, the plurality of first optical elements being dimensioned and arranged to optically couple the plurality of optoelectronic elements and a plurality of optical waveguides;
- wherein the plurality of optical elements are arranged in the first arrangement.
An apparatus for wafer-level testing a plurality of optoelectronic devices arranged in a first arrangement on a device wafer, the apparatus comprising:
- a probe card having electrical functionality and optical functionality, wherein the probe card includes a substrate comprising;
- (i) a plurality of electrical pins, the electrical pins being dimensioned and arranged to electrically activate each of the plurality of optoelectronic devices;
- (ii) a plurality of surface waveguides;
- and
- (iii) a plurality of vertical couplers, the plurality of optical elements being arranged in the first arrangement, wherein the plurality of vertical couplers is dimensioned and arranged to optically couple the plurality of optoelectronic elements and the plurality of surface waveguides.
A method for wafer-level testing a first plurality of optoelectronic devices that are arranged in a first arrangement on a device wafer, the method comprising:
- aligning a probe card and the device wafer, wherein the probe card comprises a plurality of first optical elements that are arranged in the first arrangement;
- and
- coupling a first light signal between a first optoelectronic device of the first plurality of optoelectronic devices and a first optical waveguide, wherein the first light signal is coupled through a first optical element of the plurality of first optical elements.
Dependencies are inferred from the claim text.