Process for producing a hole using different laser positions

A process for producing a hole in a substrate, the hole is a continuous film-cooling hole, the substrate having a first surface and an opposing surface, the hole includes an inner proportion and a diffuser which has a widened cross section compared to the inner proportion, comprising:

• providing a laser positioned in a first angular position;
• and
• forming the inner proportion from the first surface to the opposing surface and a portion of the diffuser at the first surface by the laser in the first angular position, a remnant of the diffuser remains after the forming, the remnant having a first remnant volume and a second remnant volume;
• removing the first remnant volume by the laser positioned in a second angular position such that the second remnant volume remains, the laser is moved while remaining in the second angular position until a flank of the diffuser is exposed, the laser beam in the second angular position is directed differently than the laser beam while in the first angular position;
• and
• removing the second remnant volume by the laser in a third angular position such that the diffuser is completely formed, the laser beam in the third angular position is directed differently than the laser beam while in the second angular position,
• wherein angular positions of the laser are defined by a center line of the laser beam and the first surface.