Wiring board and method for manufacturing the same

A method for manufacturing a wiring board, comprising:

• preparing a first multilayer wiring board comprising a plurality of first conductive layers and having a first pad on a surface of the first multilayer wiring board;
• preparing a second multilayer wiring board comprising a plurality of second conductive layers and having a second pad on a surface of the second multilayer wiring board;
• setting the surface of the first multilayer wiring board and the surface of the second multilayer wiring board such that the first pad and the second pad face each other;
• forming a penetrating hole in an adhesive layer comprising an adhesive sheet such that the penetrating hole has a hole diameter which is made greater than diameters of the first and second pads such that the penetrating hole has a clearance between the first pad and the penetrating hole and a clearance between the second pad and the penetrating hole;
• and
• interposing the adhesive layer between the surface of the first multilayer wiring board and the surface of the second multilayer wiring board such that the first multilayer wiring board and the second multilayer wiring board are adhered through the adhesive layer, that the first pad and the second pad face each other across the adhesive layer and that the penetrating hole connects the first pad and the second pad,
• wherein the interposing of the adhesive layer includes filling the clearance between the penetrating hole and the first pad with resin and filling the clearance between the penetrating hole and the second pad with resin.