Adhesive composition

An adhesive composition comprising:

• a first part comprising
• about 15 to about 30 wt % of a first epoxy compound, wherein the first epoxy compound is a bisphenol-based diepoxy compound including bisphenol-A epoxy, bisphenol-F epoxy, or a combination comprising at least one of the foregoing,
• about 30 to about 50 wt % of an epoxy novolac different from the first epoxy compound, wherein the epoxy novolac comprises the reaction product of a phenolic compound with an aldehyde, wherein phenolic hydroxy groups of the epoxy novolac are substituted with at least one glycidyl ether group, and
• about 7 to about 12 wt % of an epoxy-based reactive diluent different from the first epoxy compound and the epoxy novolac, wherein the epoxy containing reactive diluent is a C6-30 aliphatic compound comprising two or more epoxy groups,
• based on the total weight of first part;
• and
• a second part comprising
• less than about 20 wt % of a hydroxyaromatic solvent,
• about 80 to about 99 wt % of a Mannich base, and
• about 1 to about 20 wt % of a tertiary amine,
• based on the total weight of hydroxyaromatic solvent, Mannich base, and tertiary amine, the Mannich base and the tertiary amine being present in a weight ratio of about 9:1 to about 8:1;
• the first and second parts being present in a volume ratio of about 0.8:1 to about 1.2:1,
• wherein upon curing, the adhesive composition meets or exceeds requirements of ICC-ES AC-308.