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US 9,040,419 B2Granted
Semiconductor package and method for manufacturing the same
AssigneeSK hynix Inc.
InventorHo Young Son
Life of this patent
Estimating the term…
Abstract
A semiconductor package includes a semiconductor chip having a front surface and a back surface facing away from the front surface; a through electrode formed in the semiconductor chip and passing through the front surface and the back surface; and a contamination preventing layer formed in the semiconductor chip, the through electrode passing through the contamination preventing layer.
Claims10
A method for manufacturing a semiconductor package, comprising:
- preparing a semiconductor chip which has a front surface and a back surface facing away from the front surface;
- forming a contamination preventing layer in the semiconductor chip;
- forming a through electrode from the front surface of the semiconductor chip to a depth that passes through the contamination preventing layer;
- and
- removing a portion of the back surface of the semiconductor chip to expose the through electrode.
2 more elements
Dependencies are inferred from the claim text.