Carbon nanotube devices with unzipped low-resistance contacts
AssigneeInternational Business Machines Corporation
InventorsDamon B. Farmer, Aaron D. Franklin, Joshua T. Smith, George S. Tulevski
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Abstract
A method of creating a semiconductor device is disclosed. An end of a carbon nanotube is unzipped to provide a substantially flat surface. A contact of the semiconductor device is formed. The substantially flat surface of the carbon nanotube is coupled to the contact to create the semiconductor device. An energy gap in the unzipped end of the carbon nanotube may be less than an energy gap in a region of the carbon nanotube outside of the unzipped end region.
Claims20
A method of forming a semiconductor device, the method comprising:
- unzipping an end of a carbon nanotube to provide a carbon nanotube with a substantially flat surface at the end;
- forming a contact of the semiconductor device;
- and
- coupling the substantially flat surface at the end of the carbon nanotube to the contact to form the semiconductor device.
A method of forming a carbon nanotube field-effect transistor, comprising:
- unzipping an end segment of the carbon nanotube and unrolling the unzipped end segment to form a substantially planar surface;
- and
- coupling the unzipped end segment of the carbon nanotube to a contact to form the carbon nanotube field-effect transistor.
A method of reducing a contact resistance in a carbon nanotube transistor, comprising:
- unzipping an end segment of a carbon nanotube to provide a carbon nanotube with an unzipped end segment;
- forming a planar surface from the unzipped end segment of the carbon nanotube;
- and
- coupling the planar surface to a contact of the carbon nanotube transistor.
Dependencies are inferred from the claim text.