Molded interposer package and method for fabricating the same

A method for fabricating a molded interposer package, comprising:

• providing a metal sheet having a top surface and a bottom surface;
• mounting a carrier on the bottom surface of the metal sheet;
• performing an anisotropic etching process to remove a portion of the metal sheet from the top surface of the metal sheet until the carrier is exposed, thereby forming a plurality of vias through the metal sheet;
• filling a molding material into the vias, leaving the top surface of the metal sheet exposed;
• removing the carrier;
• forming a passivation layer on the top surface of the metal sheet, having a plurality of openings therethrough;
• forming a plurality of first metal vias through the opening;
• and
• forming a solder mask layer on the passivation layer, leaving the first metal vias exposed.

A method for fabricating a molded interposer package, comprising:

• providing a mold chase;
• loading a plurality of the metal lumps in the mold chase, wherein upper portions and lower portions of the metal balls are embedded in the mold chase;
• filling a molding material into the mold chase to encapsulate the metal lumps;
• taking off the mold chase, leaving the upper portions and the lower portions of the metal lumps exposed;
• removing the exposed upper portions and the lower portions of the metal lumps over a top surface and a bottom surface of the molding material;
• forming a passivation layer on the top surface of the molding material, having a plurality of openings therethrough;
• forming a plurality of first metal vias through the opening;
• and
• forming a solder mask layer on the passivation layer, leaving the first metal vias exposed.