Semiconductor packaging method using connecting plate for internal connection

A process of making a semiconductor package comprising:

• a. providing a plurality of semiconductor chips each having a plurality of electrode contact areas disposed on a top surface;
• b. providing a first connecting plate comprising a plurality of connecting plate tie bar upward regions separating the connecting plate into a plurality of connecting plate portions;
• c. electrically connecting each of the plurality of connecting plate portions to a contact area of the plurality of electrode contact areas;
• d. applying a molding compound to substantially encapsulate the plurality of semiconductor chips and the first connecting plate;
• and
• e. grinding a top surface of the molding compound and the plurality of tie bar upward regions to the extent a conductive section of each of the plurality of tie bar upward regions is removed such that each of the plurality of tie bar upward regions is electrically isolating from the other.