Sensor package and method of forming same

A method of forming sensor packages comprising:

• providing a sensor wafer having a first side and a second side opposite said first side, said first side including sensors positioned within areas on said first side delineated by first bonding perimeters;
• providing a controller wafer having a third side and a fourth side opposite said third side, said third side including control circuitry and said fourth side including second bonding perimeters;
• bonding said second bonding perimeters of said controller wafer to said first bonding perimeters of said sensor wafer to form a stacked wafer structure that includes multiple sensor packages;
• applying a packaging material over said third side of said controller wafer to encapsulate said control circuitry;
• and
• singulating said stacked wafer structure to produce said sensor packages, said singulating operation being performed following said applying operation.

A method of forming sensor packages comprising:

• providing a sensor wafer having a first side and a second side opposite said first side, said first side including sensors positioned within areas on said first side delineated by first bonding perimeters, and said first side further including first bond pads positioned outside of said areas;
• providing a controller wafer having a third side and a fourth side opposite said third side, said third side including control circuitry and second bond pads, and said fourth side including second bonding perimeters;
• bonding said second bonding perimeters of said controller wafer to said first bonding perimeters of said sensor wafer to form a stacked wafer structure that includes multiple sensor packages;
• removing portions of said controller wafer to reveal said first bond pads formed on said first side of said sensor wafer;
• attaching bond wires between corresponding ones of said first and second bond pads;
• applying a packaging material over said third side of said controller wafer to encapsulate said control circuitry and said bond wires;
• and
• following said applying operation, singulating said stacked wafer structure to produce said sensor packages.