Film-assist molded gel-fill cavity package with overflow reservoir

A method comprising:

• providing a second semiconductor device embodied within a packaged semiconductor device assembly, wherein the second semiconductor device comprises a first and second major surface;
• forming an encapsulated region over the second major surface of the second semiconductor device using an encapsulant;
• forming a cavity region in the encapsulant over a first portion of the second major surface of the second semiconductor device using a film-assisted molding technique, wherein
• a mold used for the film-assisted molding technique defines a gel stop feature along a wall of the cavity region,
• the gel stop feature comprises a gel level set feature and a gel overflow reservoir feature, wherein the gel stop feature is configured to permit silicone gel rising to a level above the gel level set feature to flow over the gel level set feature into the gel overflow reservoir feature;
• the first portion of the second major surface of the second semiconductor device is exposed in the cavity region;
• and
• affixing a first semiconductor device on at least a portion of the first portion of the second major surface of the second semiconductor device, wherein the first semiconductor device is located entirely within the cavity region.