Electronic assembly apparatus and associated methods
AssigneeAltera Corporation
InventorsNagesh Vodrahalli, Jon M. Long
Life of this patent
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Abstract
A method of fabricating an electronic assembly includes fabricating first and second interconnects. The first interconnect is adapted to interconnect a first die to a substrate. The second interconnect is adapted to interconnect the first die to a second die. The method further includes assembling the first die, the second die, and the substrate together such that the first die is disposed above the substrate, and the second die is disposed below the first die.
Claims23
A method of fabricating an electronic assembly, the method comprising:
- fabricating, using a photolithography process, a first interconnect comprising a first set of copper pillars, the first interconnect to interconnect a first die to a semiconductor substrate;
- fabricating, using the photolithography process, a second interconnect comprising a second set of copper pillars, the second interconnect to interconnect the first die to a second die;
- and
- assembling the first die, the second die, and the semiconductor substrate together such that the first die is disposed above the semiconductor substrate, and the second die is disposed below the first die.
A method of fabricating an electronic assembly, the method comprising:
- fabricating a first interconnect, the first interconnect to interconnect a first die to a substrate;
- fabricating a second interconnect, the second interconnect to interconnect the first die to a second die;
- fabricating a third interconnect, the third interconnect to interconnect the first die to a third die;
- and
- assembling the first die, the second die, the third die, and the substrate together such that the first die is disposed above the substrate, the second die is disposed below the first die, and the third die is disposed below the first die,
- wherein assembling the first die, the second die, the third die, and the substrate together further comprises disposing the second die between the first die and the third die.
A method of fabricating an electronic assembly, the method comprising:
- fabricating, using a photolithography process, a first interconnect on a first die, the first interconnect comprising a first set of copper pillars;
- fabricating, using a photolithography process, a second interconnect on the first die, the second interconnect comprising a second set of copper pillars;
- interconnecting a second die to the first die using the second interconnect;
- and
- interconnecting the first die to a semiconductor substrate using the first interconnect such that the first die and the second die are disposed above the substrate.
Dependencies are inferred from the claim text.