Power semiconductor module with method for manufacturing a sintered power semiconductor module

A method of manufacturing a sintered power semiconductor module with a sinterable temperature sensor, with the steps:

• making the temperature sensor in a planar shape with at least one planar lower face meant for sintering, and
• making an electrical contact area on the face opposite to the sintering face, said contact area being contactable on the top side by means of a commonly known method of the group:
• wire bonding or soldering or sintering or pressure contacting or ultrasonic welding,
• wherein on its lower face the temperature sensor is provided with a sinterable metallisation on a ceramic insulation layer, and
• on its function volume two electrical contact faces are provided to be electrically isolatable in relation to the sintered surface on the top side and
• electrical contacting of both contact faces after sintering occurs optionally by means of wire bonding, soldering, sintering or pressure contacting or ultrasonic welding on the top side of the contacts.