Side vented pressure sensor device

A semiconductor sensor device comprising:

• a substrate;
• a pressure sensing die and at least one other die mounted on a top side of the substrate;
• electrical interconnections between the pressure sensing die and the at least one other die;
• pressure sensitive gel material covering an active region of the pressure sensing die;
• a cap having a cavity formed therein mounted over the pressure sensing die, wherein:
• the pressure sensing die is positioned within the cavity such that the pressure sensing die is enclosed inside the cap and the substrate;
• and
• the cap has a side vent hole formed thereon that exposes the gel covered active region of the pressure sensing die to ambient atmospheric pressure outside the sensor device, wherein the side vent hole is located between a top side of the cap and the top side of the substrate and extends in a plane parallel to said top sides;
• and
• molding compound on an upper surface of the substrate encapsulating the at least one other die and at least a portion of the cap.