US 9,040,325 B2 · Method for manufacturing light emitting diode package having a voltage stabilizing module consisting of two doping layers

Abstract

A method for manufacturing an LED (light emitting diode) package comprises following steps: providing an electrically insulated base, the base having a first surface and a second surface opposite thereto; an annular voltage stabilizing module is formed on the first surface; a first electrode is formed on the first surface, wherein the first electrode is attached to and encircled by the voltage stabilizing module; a second electrode is formed on the first surface, wherein the second electrode is attached to and encircles the voltage stabilizing module; an LED chip is mounted on the first electrode, wherein the LED chip is electrically connected to the first and second electrodes, and the LED chip and the voltage stabilizing module are connected in reverse parallel. Finally, an encapsulative layer is brought to encapsulate the LED chip.

Claims9

Dependent claims

A method for manufacturing an LED (light emitting diode) package comprising following steps:

providing an electrically insulated base, the base having a first surface and a second surface opposite to the first surface;
forming an annular voltage stabilizing module on the first surface of the base;
forming a first electrode on the first surface of the base, the first electrode being attached to and encircled by the voltage stabilizing module;
forming a second electrode on the first surface of the base, the second electrode being attached to and encircling the voltage stabilizing module;
mounting at least one LED chip on the first electrode, the at least one LED chip being electrically connected to the first and second electrodes, the at least one LED chip and the voltage stabilizing module being connected in reverse parallel;
and
encapsulating the at least one LED chip with an encapsulative layer.

4 more elements

Dependencies are inferred from the claim text.

Facts

Application

14/248,340Filed 9 Apr 2014 · division

Priority

CN 2011 1 01909818 Jul 2011

Published

US 2014/0220718 A17 Aug 2014

Granted

26 May 2015

Term ends

Not estimatedThe source records don’t support an estimate.

Classification7 codes

H10H 29/14
Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00: comprising multiple light-emitting…
H10H 20/813
Bodies: having a plurality of light-emitting regions, e.g. multi-junction LEDs or light-emitting devices having photoluminescent regions within…
H10W 90/00
Package configurations
H10H 20/036
Manufacture or treatment: of packages

Method for manufacturing light emitting diode package having a voltage stabilizing module consisting of two doping layers

Life of this patent

Method for manufacturing light emitting diode package having a voltage stabilizing module consisting of two doping layers

Life of this patent

Abstract

Claims9