Microstructure manufacturing method

A microstructure manufacturing method comprising:

• forming a layer of a photosensitive resin on a substrate surface having an electrical conductivity;
• exposing a pattern on the layer of the photosensitive resin to light;
• developing the layer of the photosensitive resin to form a structure of the photosensitive resin that exposes a part of the substrate surface;
• forming a first plated layer on the exposed part of the substrate surface by soaking the structure of the photosensitive resin in a first plating solution;
• curing the structure of the photosensitive resin by at least one of exposing the structure to light and heating the structure, after forming the first plated layer;
• removing at least part of the first plated layer after curing the structure of the photosensitive resin;
• and
• forming a second plated layer on a part where the first plated layer is removed, by soaking the structure of the photosensitive resin in a second plating solution different from the first plating solution,
• wherein the second plated layer and any remaining part of the first plated layer form the microstructure,
• wherein the photosensitive resin is a negative photosensitive resin, and
• wherein the aspect ratio of a concave portion of the microstructure is 12 or more and 100 or less.