Etching solution compositions for metal laminate films
AssigneeKanto Kagaku Kabushiki Kaisha
InventorsKenji Kuroiwa, Kazuaki Nagashima, Masaru Kato, Masahiro Nohara
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Abstract
Disclosed are etching solution compositions that comprise fluorine compounds and iron ions, which are used for bulk etching of metal laminate films wherein a layer comprising aluminum or an aluminum alloy is laminated on top and a layer comprising titanium or a titanium alloy on bottom, and an etching method using said etching solution compositions.
Claims8
A method for one-time etching a metal laminate film in which a layer formed from aluminum or an aluminum alloy as an upper part and a layer formed from titanium or a titanium alloy as a lower part are laminated and which is formed on a glass substrate, the method using an etching solution composition comprising a fluorine compound and an iron ion, wherein a part of the layer formed from aluminum or an aluminum alloy is etched to expose the layer formed from titanium or a titanium alloy in the etching.
A method for one-time etching a metal laminate film in which a layer formed from aluminum or an aluminum alloy as an upper part and a layer formed from titanium or a titanium alloy as a lower part are laminated and which is formed on a glass substrate, the method using an etching solution composition comprising hydrofluoric acid at a concentration of 0.01 to 0.5 mol/L, trivalent iron ion at 0.0001 to 0.05 mol/L, nitric acid at 0.01 to 1.0 mol/L, and phosphorous acid at 0.001 to 0.1 mol/L.
Dependencies are inferred from the claim text.