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US 9,039,852 B2Granted
Method for bonding substrates using a UV radiation curing-redox curing adhesive system
AssigneesHenkel IP & Holding GmbH, Henkel (China) Company Limited
InventorsShabbir Attarwala, Nicolas Zhou, Yinxiao Yuan, Daoqiang Lu, Chongjian Song
Life of this patent
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Abstract
The present invention provides a method for bonding two substrates using a UV radiation curing-redox curing adhesive system having a shadow area and a transparent area, comprising: bonding the shadow area of the substrates using a redox curing adhesive system, and bonding the transparent area of the substrates using a liquid optically clear adhesive containing UV initiators.
Claims10
A method for bonding two substrates having a shadow area and a transparent area, comprising:
- bonding the shadow area of the substrates using a redox curing adhesive system, and bonding the transparent area of the substrates using a liquid optically clear adhesive containing UV initiators.
Dependencies are inferred from the claim text.