Interdigitated chip capacitor assembly
AssigneeTexas Instruments Incorporated
InventorsAllan Jerome Daen Rapales, Floro Lopez Camenforte, III, John Paul Quianzon Kwo
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Abstract
An interdigitated chip capacitor (“IDC”) assembly including an IDC having a semiconductor block with a top portion, a bottom portion opposite the top portion, a plurality of sidewall portions extending between the top and bottom portions, and a plurality of terminals located on the sidewall portions; and a substrate having a top portion with a plurality of generally flat, vertically extending, nonconductive abutment surfaces thereon, the sidewall portions of the IDC being abuttingly engaged with at least some of the plurality of abutment surfaces.
Claims8
An interdigitated chip capacitor (“IDC”) assembly comprising:
- an IDC comprising:
- a semiconductor block with a top portion, a bottom portion opposite said top portion and a plurality of sidewall portions extending between said top and bottom portions;
- and
- a plurality of terminals located on said sidewall portions;
- and
- a substrate a top portion with a plurality of nonconductive vertically extending abutment surfaces thereon, further comprising a plurality of recess wall portions defining a central recess therein, wherein said substrate top portion comprises a plurality of grooves projecting outwardly from said central recess;
- said sidewall portions of said IDC being abuttingly engaged with at least some of said plurality of abutment surfaces.
Dependencies are inferred from the claim text.