Material deposition system and method for depositing materials on a substrate

A material deposition system for depositing material on an electronic substrate, the material deposition system comprising:

• a frame;
• a support coupled to the frame, the support being configured to support an electronic substrate during a deposit operation;
• a gantry coupled to the frame;
• and
• a deposition head coupled to the gantry, the deposition head being movable over the support by movement of the gantry, the deposition head including
• a chamber configured to hold material,
• an actuator configured to push a volume of material out of the chamfer,
• a needle extending from the chamber and terminating in a needle orifice, and
• at least two air jets located on opposite sides of the needle orifice,
• wherein a desired volume of material is formed at the needle orifice in response to the actuator,
• wherein each of the at least two air jets produce a timed pulse of air to create a micro-droplet from the desired volume and to accelerate the micro-droplet to high velocity, and
• wherein the timed pulse is directed perpendicular to a direction of the micro-droplet.