Method for producing inkjet head, inkjet head, method for producing inter-member electrification structure, and inter-member electrification structure

A method for producing an inkjet head, the inkjet head comprising:

• a head substrate comprising:
• a plurality of pressure chambers that are provided in accordance with a plurality of nozzles configured to discharge an ink, respectively, and accommodate the ink discharged from the nozzles;
• a plurality of piezoelectric elements that are arranged in accordance with the pressure chambers, respectively, and apply a pressure used for discharging the ink in the pressure chambers from the nozzles;
• and a plurality of drive electrodes provided in accordance with the piezoelectric elements, respectively;
• and
• a wiring substrate having wiring lines through which electric power is fed to the respective piezoelectric elements through the drive electrodes,
• the method comprising:
• pressure-welding the wiring substrate to the head substrate by heat through resin adhesive sections comprising a thermosetting resin so that the drive electrodes are electrically connected to the wiring lines through solder bumps;
• and joining the head substrate to the wiring substrate,
• wherein the electrical connection between the drive electrodes and the wiring lines is an electrical connection based on joining of the solder bumps and stud bumps which are not molten at a temperature of heat pressure welding, either the solder bumps or the stud bumps are provided on the drive electrode side, and the other bumps are provided on the wiring line side;
• and
• a melting point TB[° C.] of the solder bump and a cure initiation temperature TR[° C.] of the resin adhesion section meet a relation (TR[° C.]≦TB[° C.]≦TR+30[° C.]).